Solderless Breadboard with 840 Tie Points - 165 x 56 x 8.5mm

• Solderless breadboard — ideal for testing, prototyping, and experimentation
• 840 tie points total: 200 in 2 power rails, 640 in a 64 × 10 matrix terminal strip
• Phosphor bronze spring clips with nickel plating. Accepts wires 21 to 26 AWG or pins of 0.4 to 0.7mm diameter.
• Measures 165 × 56 × 8.5mm. ABS plastic construction with 6 mounting holes. Embossed legend.
• Great for building and testing new circuits because parts can be easily inserted and removed

Solderless breadboard — ideal for testing, prototyping, and experimentation. Features 840 tie points total: 200 in 2 power rails and 640 in a 64 × 10 matrix terminal strip. Phosphor bronze spring clips with nickel plating. The tie points accept wires 21 to 26 AWG or pins of 0.4 to 0.7mm diameter. Measures 165 × 56 × 8.5mm. ABS plastic construction with 6 mounting holes. Embossed legend. Great for building and testing new circuits because parts can be easily inserted and removed.

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